CfP - SIES 2014, 9th IEEE International Symposium on Industrial Embedded Systems
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CALL FOR PAPERS - SIES 2014
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IEEE Symposium on Industrial Embedded Systems - SIES 2014
June 18-20, 2014, Scuola Superiore S. Anna, Pisa, Italy
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Conference web site: http://retis.sssup.it/sies2014
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Application domains have had a considerable impact on the evolution of
embedded systems, in terms of required methodologies and supporting tools
and resulting technologies. SoCs are slowly making inroads in to the area
of industrial automation to implement complex field-area intelligent devices
which integrate the intelligent sensor/actuator functionality by providing
on-chip signal conversion, data processing, and communication functions.
There is a growing tendency to network field-area intelligent devices around
industrial type of communication networks. Similar trends appear in the
automotive electronic systems where the Electronic Control Units (ECUs),
typically implemented as heterogeneous system-on-chip, are networked by
means of one of safety-critical communication protocols such as FlexRay,
for instance, for the purpose of controlling one of vehicle functions;
electronic engine control, ABS, active suspension, etc. The design of this
kind of networked embedded systems (this includes also hard real-time
industrial control systems) is a challenge in itself due to the distributed
nature of processing elements, sharing common communication medium, and
safety-critical requirements, to mention some.
The aim of the symposium is to bring together researchers and practitioners
from industry and academia and provide them with a platform to report on
recent developments, deployments, technology trends and research results,
as well as initiatives related to embedded systems and their applications
in a variety of industrial environments.
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TOPICS include, but are not limited to:
* EMBEDDED SYSTEMS: Design and Validation of Embedded Systems; Real-Time
Issues; Models of Embedded Computation; Design and Verification Languages;
Operating Systems and Quasi-Static Scheduling; Timing and Performance
Analysis; Power Aware Embedded Computing; Adaptive Embedded Systems;
Security in Embedded Systems.
* SYSTEMS-ON-CHIP and NETWORK-ON-CHIP DESIGN & TESTING: Design of
Application-Specific Instruction-Set Processors; Design and Programming
of Embedded Multiprocessors; SoC Communication and Architectures; NoC
Communication and Architectures; Design of SoC/NoC; Platform-Based Design
for Embedded Systems; Reconfigurable Platforms; Multiprocessor SoC
Platforms and Tools; Testing of Embedded Core-based Integrated Circuits.
* NETWORKED EMBEDDED SYSTEMS: Design Issues for Networked Embedded;
Middleware Design and Implementation for Networked Embedded Systems;
Self Adaptive Networked Entity Sensor Networks: Architectures,
Energy-Efficient Medium Access Control, Time Synchronization Issues,
Distributed Localization Algorithms, Routing, Distributed Signal
Processing, Security.
* EMBEDDED APPLICATIONS: Industrial Automation and Controls; Automotive
Applications; Industrial Building Automation and Control; Power (sub-)
Station Automation and Control; Intelligent Sensors, etc. - design,
maintenance, fault tolerance & dependability, networks, infrastructure,
safety and security.
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SUBMISSION OF PAPERS
Manuscripts must be submitted electronically in PDF format, according to
the instructions contained in the Conference web site. Contributions must
contain original unpublished work. Papers that have been concurrently
submitted to other conferences or journals (double submissions) will be
automatically rejected. Papers are to be submitted electronically in PDF
format.
Two types of submissions are solicited:
Long Papers - from 6 to 10 double-column pages (typically 8 pages).
Work-in-Progress Papers - limited to 4 double-column pages.
For further details, please consult the conference web pages.
Paper Acceptance:
Each accepted paper must be presented at the conference by one of the authors.
The final manuscript must be accompanied by a registration form and a
registration fee payment proof. All conference attendees, including authors
and session chairpersons, must pay the conference registration fee, and
their travel expenses.
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AUTHOR'S SCHEDULE
Regular Papers:
Submission deadline: February 24, 2014
Notification for acceptance: April 7, 2014
Deadline for final manuscript: May 19, 2014
WiP Papers: (dates subject to change)
Submission deadline: April 14, 2014
Notification for acceptance: May 5, 2014
Deadline for final manuscript: May 19, 2014
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WORKSHOP CHAIRS
GENERAL CHAIRS
- Marco Di Natale - Scuola Superiore S. Anna, Pisa
- Roberto Passerone - University of Trento, Italy
PROGRAM CHAIRS
- Giorgio Buttazzo - Scuola Superiore S. Anna, Pisa
- Enrico Macii - Politecnico di Torino
PROGRAM COMMITTEE
- Andrea Acquaviva -Politecnico di Torino, Italy
- Jung Ho Ahn - Seoul National University, Korea
- Luis Almeida - University of Porto, Portugal
- Mario Alves - ISEP, IPP, Portugal
- Paul Ampadu - University of Rochester, USA
- David Atienza - EPFL, Switzerland
- Hakan Aydin - George Mason University, USA
- Sanjoy Baruah - University of North Carolina at Chapel Hill, USA
- Moris Behnam - Malardalen University, Sweden
- Davide Bertozzi - University of Ferrara, Italy
- Nicola Bombieri - University of Verona, Italy
- Philippe Coussy - UniversitA(c) de Bretagne-Sud
- Tommaso Cucinotta - Bell Laboratories, Alcatel-Lucent, Ireland
- Liliana Cucu-Grosjean - INRIA, France
- Radu Dobrin - MRTC/MA$?lardalen University, Sweden
- Petru Eles - LinkAPping University, Sweden
- Johan Eker - Ericsson Research, Sweden
- Tullio Facchinetti - University of Pavia, Italy
- Alain Girault - INRIA, France
- Kees Goossens - Eindhoven Univ. of Technology, NL
- Kim Gruettner - OFFIS, Germany
- Tei-Wei Kuo - National Taiwan University, Taiwan
- Luciano Lavagno - Politecnico di Torino, Italy
- Hai (Helen) Li - University of Pittsburgh, USA
- George Lima - Federal University of Bahia, Brazil
- Giuseppe Lipari - Scuola Superiore Sant'Anna, Italy
- Lucia Lo Bello - University of Catania, Italy
- Marisa Lopez Vallejo - UPM, Spain
- Mauro Marinoni - Scuola Superiore Sant'Anna, Italy
- Pau Marti - Technical University of Catalonia (UPC), Spain
- Ahlem Mifdaoui - University of Toulouse, ISAE, France
- Tulika Mitra - National University of Singapore, SG
- Roberto Passerone - University of Trento, Italy
- Paulo Pedreiras - University of Aveiro, Portugal
- Isabelle Puaut - IRISA, France
- Luca Santinelli - ONERA, France
- Zili Shao - Hong Kong Polytechnic University, HK
- Cristina Silvano - Politecnico di Milano, Italy
- Tullio Vardanega - University of Padova, Italy
- Yifan Wu - Hangzhou Dianzi University, China
- Sungjoo Yoo - Postech, Korea
- Haibo Zeng - McGill University, Montreal, Canada
- Qi Zhu - University of California at Riverside
FINANCE CHAIRS
- R. Zurawski, ISA Group, USA
SIES STEERING COMMITTEE
- R. Ernst - TUB, Germany
- G. De Micheli - EPFL, Switzerland
- R. Gupta - UC San Diego, USA
- A. S.-Vincentelli - UC Berkeley, USA
- R. Zurawski - ISA Group, USA
INTERNATIONAL ADVISORY COMMITTEE
- E. Dekneuvel - UNSA, France
- L. Gomes - Uninova, Portugal
- T. Nolte - MA$?lardalen Univ., Sweden
- R. Passerone - Univ. of Trento, Italy
- G. Sassatelli - LIRM, France
- A. Vachoux - EPFL, Switzerland
- J. J. Chen - KIT, Germany
- E. Tovar - Univ. Porto, Portugal
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FURTHER INFORMATION:
SIES 2014 Conference Secretariat