CALL FOR PAPERS - SIES 2015: New Extended Submission Deadline
10th IEEE Symposium on Industrial Embedded Systems - SIES 2015
University of Siegen, Siegen, Germany
June 8-10, 2015
*** New Extended Submission Deadline: March 15, 2015 ***
Conference web site: www.sies2015.com
Submission system: https://easychair.org/conferences/?conf=sies2015
The aim of the symposium is to bring together researchers and practitioners from industry and academia and provide them with a platform to report on recent developments, deployments, technology trends and research results, as well as initiatives related to embedded systems and their applications in a variety of industrial environments.
TOPICS include, but are not limited to:
- Embedded Systems: Design and Validation of Embedded Systems; Real-Time
Issues; Models of Embedded Computation; Design and Verification
Languages; Operating Systems and Quasi-Static Scheduling; Timing and
Performance Analysis; Power Aware Embedded Computing; Adaptive Embedded
Systems; Security in Embedded Systems.
- System-on-Chip and Network-on-Chip Design & Testing: Design of
Application-Specific Instruction-Set Processors; Design and Programming
of Embedded Multiprocessors; SoC Communication and Architectures; NoC
Communication and Architectures; Design of SoC/NoC; Platform-Based Design
for Embedded Systems; Reconfigurable Platforms; Multiprocessor SoC
Platforms and Tools; Testing of Embedded Core-based Integrated Circuits.
- Networked Embedded Systems: Design Issues for Networked Embedded;
Middleware Design and Implementation for Networked Embedded Systems; Self
Adaptive Networked Entity Sensor Networks: Architectures, Energy-
Efficient Medium Access Control, Time Synchronization Issues, Distributed
Localization Algorithms, Routing, Distributed Signal Processing, Security.
- Embedded Applications: Industrial Automation and Controls; Automotive
Applications; Industrial Building Automation and Control; Power (sub-)
Station Automation and Control; Intelligent Sensors, etc. - design,
maintenance, fault tolerance & dependability, networks, infrastructure, safety and security.
SUBMISSION OF PAPERS
Manuscripts must be submitted electronically in PDF format, according to the instructions contained in the Conference web site. Contributions must contain original unpublished work. Papers that have been concurrently submitted to other conferences or journals (double submissions) will be automatically rejected.
Two types of submissions are solicited: Long Papers - from 6 to 10 double- column pages (typically 8 pages). Work-in-Progress Papers - limited to 4 double-column pages. For further details, please consult the conference web pages.
Each accepted paper must be presented at the conference by one of the authors. The final manuscript must be accompanied by a registration form and a registration fee payment proof. All conference attendees, including authors and session chairpersons, must pay the conference registration fee, and their travel expenses.
All papers, including the WiP, are going to be published in IEEEXplore.
AUTHOR'S SCHEDULE
Deadline for submission of regular papers: March 15, 2015
Notification for acceptance of regular papers: April 13, 2015
Deadline for final manuscript of regular papers: May 8, 2015
Deadline for submission of WiP papers: April 19, 2015
Notification for acceptance of WiP papers: May 3, 2015
Deadline for final manuscript of WiP papers: May 15, 2015
ORGANIZERS
SIES 2015 General Chairmen:
Roman Obermaisser, University of Siegen, Germany Roberto Passerone, University of Trento, Italy
SIES 2015 Program Chairmen:
Marco Di Natale, Scuola Superiore S. Anna, Pisa, Italy Achim Rettberg, Carl von Ossietzky University Oldenburg, Germany
SIES 2015 Finance Chairmen:
Richard Zurawski, ISA Group, USA
Marcin Grzegorzek, University of Siegen, Germany
SIES Series Steering Committee
Rolf Ernst, TUB, Germany
Giovanni De Micheli, EPFL, Switzerland
Rajesh Gupta, UC San Diego, USA
Alberto Sangiovanni-Vincentelli, UC Berkeley, USA Richard Zurawski, ISA Group, USA
SIES 2015 International Advisory Committee
Eric Dekneuvel, UNSA, France Luis Gomes, Uninova, Portugal Thomas Nolte, Malardalen University, Sweden Roberto Passerone, Univ. of Trento, Italy Gilles Sassatelli, LIRM, France Eduardo Tovar, IPP, Portugal Alain Vachoux, EPFL, Switzerland Jian-Jia Chen, KIT, Germany
Marco Di Natale, Scuola Superiore S. Anna, Italy
SIES 2015 TECHNICAL PROGRAM COMMITTEE
Liliana Cucu-Grosjean, INRIA Paris-Rocquencourt Hakan Aydin, George Mason University Luciano Lavagno, Politecnico di Torino Luca Santinelli, ONERA Nicola Bombieri, University of Verona Giorgio Buttazzo, Scuola Superiore Sant'Anna Giuseppe Lipari, Scuola Superiore Sant'Anna Haibo Zeng, McGill University Luigi Palopoli, University of Trento Sebastian Obermeier, ABB Corporate Research Marcio Kreutz, Universidade Federal do Rio Grande do Norte Moris Behnam, MRTC/Malardalen University Luis Almeida, Fac. de Eng. da Universidade do Porto Stefan Schneele, Airbus Group Innovations Michael Wahler, ABB Corporate Research Tullio Vardanega, University of Padua Kim Gruettner, OFFIS Paulo Pedreiras, University of Aveiro Petru Eles, Linkoping University Enrico Macii, Politecnico di Torino David Broman, University of California, Berkeley Rene Graf, Siemens AG Industry Sector Christoph Scherrer, Thales Austria GmbH Sara Tucci-Piergiovanni, CEA LIST Alain Girault, INRIA Ahlem Mifdaoui, University of Toulouse / ISAE Mario Alves, CISTER Research Unit, Politecnico do Porto Tullio Facchinetti, University of Pavia Sanjoy Baruah, University of North Carolina Rodolfo Pellizzoni, University of Waterloo David Atienza, Embedded Systems Laboratory, STI, EPFL Mauro Marinoni, Scuola Superiore Sant'Anna Hai Li, University of Pittsburgh Jung Ho Ahn, Seoul National University Marcello Coppola, STMicroelectronics Stig Petersen, SINTEF Kees Goossens, Eindhoven University of Technology George Lima, Federal University of Bahia Philippe Coussy, Universit de Bretagne Sud / Lab-STICC Wilfried Steiner, TTTech Computertechnik AG Marcelo Gotz, Federal University of Rio Grande do Sul Manuel Oriol, ABB Corporate Research Pau Marti, Technical University of Catalonia Dominik Reinhardt, BMW AG Qi Zhu, University of California Riverside