Visible to the public CfP: ICESS 2015: 12th IEEE International Conference on Embedded Software and Systems

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The 12th IEEE International Conference on Embedded Software and Systems (ICESS 2015)

August 24-26, 2015 in New York, USA
http://cse.stfx.ca/~icess2015/
Co-located with HPCC 2015 and CSS 2015NEWS on special issues:

. ACM TECS Special Issue on Emerging Technologies in Embedded Software and Systems
. JSA Special Issue on High Performance Computing and Communications and Embedded Software and Systems
. JSA Special Issue on Design Automation for Embedded Ubiquitous Computing Systems

*IMPORTANT DATES*

Abstract submission : Apr. 03, 2015
Paper submission : Apr. 17, 2015
Notification date : Jun. 15, 2015
Camera-Ready due : Jul. 15, 2015

*SCOPE*

As the fastest growing industry, embedded systems have great societal and
environmental impacts. Embedded software and systems have been crucial to our
daily life, ranging from smart appliances to unmanned trains/vehicles. Therefore,
the design and implementation of safe and efficient embedded software and
systems have utmost importance. IEEE ICESS is an international forum for
researchers and developers from academia, industry and government to present
and discuss the science, engineering, technology and emerging ideas and trends
of embedded software and systems.

Successful submissions should contain significant novel ideas and technical
results, which have not been published or concurrently submitted to any
other venue. Topics of interest include, but are not limited to:

1. Systems, Models and Algorithms (SMA)

  • Embedded System Architecture
  • Embedded Software Architectures
  • Embedded OS, Scheduling and Runtime Support
  • Embedded Storage and I/O Systems
  • Real-Time Embedded Systems
  • Distributed and Networked Embedded Systems
  • Fault Tolerant and Trusted Embedded Systems
  • Mixed-Critical Embedded Systems
  • Heterogeneous SoC and Multicore Embedded Systems
  • Power and Thermal Aware Computing
  • Pervasive/Ubiquitous Computing
  • Reconfigurable Embedded Computing

2. Design Methodology and Tools (DMT)

  • Design Technologies of Embedded Systems
  • Formal Methods for Embedded Systems
  • Middleware for Embedded Systems
  • IDE and Software Tools
  • Hardware/Software Co-Design
  • Component-Based Embedded Software Design
  • Model-based Design for Embedded Software
  • Domain/Application-Specific Design Techniques
  • Testing Techniques for Embedded Software/Systems
  • Verification and Validation for Embedded Systems
  • Compilation and Debug Techniques and Tools
  • Performance Evaluation Techniques and Tools

3. Emerging Embedded Applications and Interdisciplinary Topics (EIT)

  • Intelligent Embedded Systems
  • Robotics and Control Systems
  • Wireless Sensor Networks (WSN)
  • Cyber-Physical Systems
  • Embedded Automotive, Medical and Avionics Systems
  • Embedded Database & Multimedia Systems
  • QoS Support for Embedded Systems
  • Embedded Network Protocol and Security
  • Emergency and Disaster Management
  • Consumer Electronics
  • Mobile Cloud Computing
  • Industrial Practices and Case Studies

*PAST HISTORY*

The ICESS-2015 conference is the next event in a series of highly successful
international conferences on embedded software and systems, held
as ICESS 2014 (Paris, France, August 2014), ICESS 2013 (Sydney, Australia,
December 2013), ICESS 2012(Liverpool, England, UK, June 2012), ICESS 2011
(Changsha, China, November 2011), ICESS 2010 (Bradford, UK, July 2010),
ICESS 2009 (Hangzhou, Zhejiang, China, May 2009), etc.

*SUBMISSION INSTRUCTIONS*

All paper submissions must represent original and unpublished work. Submitted
manuscripts should be written in English conforming to the IEEE conference
proceedings format (8.5" x 11", Two-Column, template available at
http://www.computer.org/portal/web/cscps/formatting). Papers must be submitted electronically in PDF format through EasyChair at the following web pages
https://easychair.org/conferences/?conf=icess2015.

The page limit for submitted manuscripts is up to 12 pages, including tables,
figures and references. After the review process, manuscripts may be accepted
as one of the three paper types: Full Papers (6 pages complementary, and up to
12 pages with over length charge), Short Papers (4 pages complementary and up to
6 pages with over length charge), or Posters (1 page complementary, and up to 2
pages with over length charge).

*PUBLICATIONS*

The accepted papers from this conference will be published by IEEE Computer
Society in IEEE proceedings (indexed by EI Compendex). By submitting a paper
to the conference, authors assure that if the paper is accepted, at least
one author will attend the conference and present the paper.

Distinguished papers, after further revisions, will be invited for possible
publication in several SCI & EI indexed special issues of prestigious
international journals. Please see the conference webpage for details.

*CONFERENCE COMMITTEES*

General Chair
Meikang Qiu, Pace University, USA

General Co-Chairs
Sun-Yuan Kung, Princeton University, USA
Jack Dongarra, University of Tennessee, Knoxville, USA

Program Chairs
Samarjit Chakraborty, Technical University Of Munich, Germany
Dakai Zhu, University of Texas at San Antonio, USA

Track Chairs
(1) Systems, Models and Algorithms (SMA)
Dakai Zhu, University of Texas at San Antonio, USA

(2) Design Methodology and Tools (DMT)
Dionisio de Niz, Carnegie Mellon University, USA
Qi Zhu, University of California, Riverside, USA

(3) Emerging Embedded Applications and Interdisciplinary (EAI)
Song Han, University of Connecticut, USA
Christian Poellabauer, University of Notre Dame, USA

Publicity Co-Chairs
Weichen Liu, Chongqing University, China
Ying Lu, University of Nebraska - Lincoln, USA
Geoffrey Nelissen, Instituto Superior de Engenharia do Porto, Portugal

Publication Chair
Tam Chantem, Utah State University, USA

Workshop Chair
Chun Jason Xue, City University of Hong Kong, Hong Kong

Steering Committee Co-Chairs
Zhaohui Wu, Zhejiang University, China
Laurence T. Yang, St. Francis Xavier University, Canada

Technical Program Committee: See conference webpage.