2015 Workshop on Resiliency in Embedded Systems - Call for Submissions
1st International ESWEEK Workshop on Resiliency in Embedded Electronic Systems (REES 2015)
October 8th, 2015 | Amsterdam, The Netherlands
Extended abstract deadline: July 28, 2015
More information: http://www.edacentrum.de/rees
With the sheer complexity of hardware and software systems, resiliency became a major challenge in embedded systems design, manufacturing, and operation. For industrial applications several standards such as ISO26262, IEC61508 or DO-254 prescribe a well-defined level of reliability, robustness, and fault-tolerance.
This joint academic/industry workshop addresses all resiliency aspects in hardware and software systems design and operation from different embedded system areas such as automotive, avionics, and industry automation. This includes, but is not limited to, design bugs and cross-layer and cross-domain design techniques from software (applications, operating systems, middleware) to hardware (system, architecture, circuits, device level). Of special interest are design-for-resiliency technologies, resilient-specific design flows,
like integrated functional/stochastic approaches, and development frameworks for robust designs, such as virtual prototyping approaches, which support early evaluations and estimations to obtain high reliability with less cost.
Interested contributors are invited to submit an extended abstract with the description and the status of their work including clear
references to already published articles or reports. Extended abstract are requested in PDF format following the IEEE manuscript templates for conference proceedings. Formatting and submission instructions are available at the REES2015 workshop website at www.edacentrum.de/rees.
Authors of accepted submissions are asked to upload their workshop paper (2-8 pages) for the online proceedings and should be prepared for an oral presentation and for a discussion in front of their poster after their session. The official workshop proceedings will become available 4 weeks after the workshop. Organizers plan to organize a special journal issue for the publication of selected papers.
Please check www.edacentrum.de/rees for recent information and instructions.
Deadlines
- Extended abstract submission (1-2 pages): July 28, 2015
- Notification of acceptance: August 24 2015
- Workshop Paper (2-8 pages): September 27, 2015
- REES Workshop: October 8, 2015
- Camera-Ready Proceedings Paper (2-8 pages): October 19, 2015
General Co-Chairs
- Daniel Muller-Gritschneder, Technical University of Munich, Germany
- Wolfgang Muller, Heinz Nixdorf Institute/University of Paderborn, Germany
- Subhasish Mitra, Stanford University CA, USA