Special Issue - Second Deadline Extension] Real-Time Energy-Aware Circuits and Systems for HEVC and for its 3D and SVC Extension
2ND CALL FOR PAPERS
SPECIAL ISSUE: "Real-Time Energy-Aware Circuits and Systems for HEVC and for its 3D and SVC Extensions"
- JOURNAL: Journal of Real-Time Image Processing (Springer)
- IMPACT FACTOR (2014): 2.020
- MANUSCRIPT DUE: December 15, 2015 - Hard Deadline (already extended)
http://www.springer.com/computer/image+processing/journal/11554
DESCRIPTION:
The Journal of Real-Time Image Processing (ISI IF=1.111) is an international journal focused on real time aspects of image and video processing systems and algorithms for industrial, medical, consumer electronics, portable and embedded device applications. Under this very specific domain, it presents practical, low-cost, and real-time processing architectures and systems, as well as tools, simulation and modeling for real-time processing algorithms and their implementations.
SCOPE:
Since its formal approval, in 2013, the High Efficiency Video Coding (HEVC) standard has established as the new state of the art on video compression. When compared with the previous standards, it has been shown that HEVC encoders can achieve equivalent subjective visual quality as H.264/AVC encoders, when using approximately 50% less of the bit rate. However, such coding efficiency comes at cost of a substantial increase of the computational complexity of both the video encoder and the decoder. As a consequence, real-time implementations of HEVC codecs is still an open and challenging task, only attained by using special purpose circuits and systems.
Complementarily, the recent advent of 3D video technologies and of Scalable Video Coding (SVC) extensions has pushed the formal definition of the HEVC, together with the development of convenient high-throughput and real-time encoding/decoding systems and supporting hardware.
However, although conventional approaches often relying on programmable and/or dedicated parallel processing platforms already allow achieving a significant performance level, important compromises have to be established in order to cope with the strict energy efficiency requirements imposed at the several different application domains (e.g. mobile, battery supplied and hand-held devices). As a consequence, energy efficiency is gradually becoming one fundamental constraint and requisite for video encoding/decoding systems design, often requiring the adoption of new technologies and micro-architecture design approaches.
This special issue is mainly focused on the new design and development trends of energy efficient and real-time processing architectures for HEVC systems design. Topics of interest cover all aspects of this research domain, including not only architectures but also algorithms and circuits.
TOPICS OF INTEREST INCLUDE:
Prospective authors are invited to submit manuscripts related to efficient implementations of real time HEVC encoding systems and/or its 3D and SVC extensions. Potential topics of interest include, but are not limited to:
- Low-latency HEVC encoding circuits and systems for interactive applications
- High-throughput VLSI hardware for HEVC codecs (e.g. Ultra-HD 8k)
- ASICs and dedicated architectures for real-time processing
- Multi-core and multi-processor systems, SoCs, and NoCs
- Dynamically reconfigurable/adaptable encoding and decoding systems
- Energy-aware real-time HEVC codecs supported on embedded processors (e.g. ARM's big.LITTLE), embedded GPUs (e.g., ARM's Mali, NVIDIA's Tegra) or low power FPGA-based SoCs (e.g. Xilinx's Zynq)
- Low-power and energy-aware HEVC codec design techniques
- Performance-power-energy aware strategies
- HEVC SW/HW co-design and partitioning
- Optimized memory hierarchies and system organization for real-time HEVC coding
IMPORTANT DATES
Manuscript Submission: October 4, 2015 - Hard Deadline
Acceptance Notification: March 31, 2016
Final Manuscript: June 30, 2016
SUBMISSION PROCEDURE
Authors from academia and industry working in the above or closely related research areas are invited to submit original manuscripts that have not been published and are not currently under review by other journals or conferences. All potential authors are requested to volunteer as reviewers in the peer-review process for manuscripts submitted for this special issue.
To ensure that all manuscripts are correctly identified for consideration by the Special Issue, the authors should select "S.I.: Real-Time Energy-Aware Circuits and Systems for HEVC and 3D/SVC" when they reach the "Article Type" step in the submission process. For further questions or inquiries, please contact the Guest Editors.
GUEST EDITORS:
- Leonel Sousa, IST, Univ. Lisboa (Leonel.Sousa@tecnico.ulisboa.pt)
- Nuno Roma, INESC-ID, Univ. Lisboa (Nuno.Roma@inesc-id.pt)
INFO:
For more information about this special issue, please visit:
http://www.springer.com/computer/image+processing/journal/11554