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CALL FOR REGULAR, SPECIAL SESSIONS, & WORK IN PROGRESS PAPERS
CALL FOR TUTORIALS & WORKSHOPS

12th IEEE International Symposium on Industrial Embedded Systems (SIES 2017)

June 7-9, 2017 | Toulouse, France | Web site: http://sies2017.org

Sponsors:
IEEE Council on Electronic Design Automation (requested) and ONERA, Toulouse Center

Deadline for submission of regular & special sessions papers: March 3, 2017
Deadline for submission of work-in-progress papers: Avril 24, 2017

The IEEE symposium brings together researchers and practitioners from industry and academia
and provides them with a platform to report on recent developments, deployments, technology trends
and research results, as well as initiatives related to embedded systems and their applications
in a variety of industrial environments.

About the Symposium:

The SIES symposium series, which started in 2006, is an annual event organized by some of the leading research groups involved in research on embedded systems and applications.

The series was hosted by University of Nice Sophia Antipolis, France (2006); Uninova, Portugal (2007); LIRMM/CNRS, France (2008); Ecole Polytechnique Federale de Lausanne, Switzerland (2009);
University of Trento, Italy (2010); Malardalen University, Sweden (2011); Karlsruhe Institute of Technology, Germany (2012); Polytechnic Institute of Porto, Portugal (2013); Scuola Superiore S. Anna, Italy (2014)
Siegen University, Germany (2015) and AGH University of Science and Technology, Poland (2016)

FOCUS:

(Networked) Embedded systems and their applications in diverse industrial
environments

TOPICS

Embedded Systems:

  • Design and Validation of Embedded Systems,
  • Real-Time Issues,
  • Models of Embedded Computation,
  • Design and Verification Languages,
  • Operating Systems and Quasi-Static Scheduling,
  • Timing and Performance Analysis,
  • Power Aware Embedded Computing,
  • Adaptive Embedded Systems,
  • Security in Embedded Systems.

System-on-Chip and Network-on-Chip Design & Testing:

  • Design of Application-Specific Instruction-Set Processors,
  • Design and Programming of Embedded Multiprocessors,
  • SoC Communication and Architectures,
  • NoC Communication and Architectures,
  • Design of SoC/NoC
  • Platform-Based Design for Embedded Systems,
  • Reconfigurable Platforms,
  • Multiprocessor SoC Platforms and Tools,
  • Testing of Embedded Core-based Integrated Circuits.

Networked Embedded Systems:

  • Design Issues for Networked Embedded,
  • Middleware Design and Implementation for Networked Embedded Systems;,
  • Self Adaptive Networked Entity Sensor Networks: Architectures, Energy-Efficient Medium Access Control, Time Synchronization Issues, Distributed Localization Algorithms, Routing, Distributed Signal Processing, Security

Embedded Applications:

  • Cyber-physical systems and Internet of Things, including Industrial Automation and Controls,
  • Automotive Applications,
  • Intelligent Transportation Systems,
  • Smart Home,
  • Wireless Health Care,
  • Industrial Building Automation and Control,
  • Power (sub-)Station Automation and Control,
  • etc. - design, maintenance, fault tolerance & dependability, networks, infrastructure, safety and security.

General Co-Chairs:

  • Luca Santinelli - ONERA, France
  • Marco Di Natale - SSSA, Italy

Program Committee Chairs:

  • Guiseppe Lipari - University of Lille, France
  • Luis Almeida - University of Porto, Portugal

Work-in-Progress Chairs:
Roman Obermaisser
University of Siegen, Germany
Jean-Luc Sharbarg - IRIT, France

Special Sessions Chairs:

  • Patrick Meumeu - CISTER-IPP, Portugal
  • Roberto Passerone - University of trento, Italy

Financial Chair:

  • R. Zurawki, ISA Group, USA

IEEE CEDA Representative:

  • Yao-Wen Chang - National Taiwan University, Taiwan

Local Organizing Co-Chair:

  • Luca Santinelli - ONERA, France

Local Committee:

  • Service Communication - ONERA,Toulouse - France

SIES Series Steering Committee:

  • R. Ernst, TUB, Germany
  • G. De Micheli, EPFL, Switzerland
  • R. Gupta, UC San Diego, USA
  • A. Sangiovanni-Vincentelli, UC Berkeley, USA
  • R. Zurawski, ISA Group, USA

International Advisory Committee:

  • J. J. Chen, KIT, Germany
  • E. Dekneuvel, UNSA, France
  • M. Di Natale, Scuola Superiore S. Anna, Pisa, Italy
  • L. Gomes, Uninova, Portugal
  • T. Nolte, Malardalen University, Sweden
  • R. Obermaisser, University of Siegen, Germany
  • R. Passerone, Univ. of Trento, Italy
  • G. Sassatelli, LIRM, France
  • E. Tovar, IPP, Portugal
  • A. Vachoux, EPFL, Switzerland


SUBMISSIONS: Two types of submissions are solicited. Long Papers from 6 to 10
double column pages in a font no smaller than 10-points. Work-in-Progress limited
to 4 double column pages in a font no smaller than 10-points.

FOR SUBMISSION DETAILS SEE THE CONFERENCE WEB SITE
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THE CALL FOR SPECIAL SESSIONS WILL BE COMMUNICATED
FOR DETAILS OF THE CALL FOR TUTORIALS & WORKSHOPS SEE THE CONFERENCE WEB SITE
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CONTACT INFORMATION

E-mail: contact@sies2017.org

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***** Deadline for submission of regular & special sessions papers: March 3, 2017 *****
***** Deadline for submission of work-in-progress papers: April 24, 2017 *****