CfP (ext. deadline): 13th IEEE SIES 2018 (in conjunction with 2nd IoT Symposium)

CALL FOR POSTERS

13th IEEE International Symposium on Industrial Embedded Systems (SIES)

In conjunction with "2nd Symposium on Dependable Internet of Things" June 5, 2018, Graz, Austria

• Regular Paper submission deadline: March 11, 2018 (extended, hard)
• Acceptance notification: April 4, 2018
• Camera ready deadline: May 4, 2018
• WiP and Poster Submission Deadline: April 13, 2018
• Acceptance notification: April 26, 2018
• Camera ready deadline: May 4, 2018

The IEEE Symposium on Industrial Embedded Systems (SIES) is a highly selective
single-track international conference focusing on premier research results for
embedded systems - an area of highest relevance for visionary technologies
such as the Internet of Things (IoT) and applications such as Industry 4.0,
Smart Production, Smart Cities, Connected Cars, etc.

The featured topic of SIES 2018 is "ICT for a Dependable Internet of Things",
where increasingly complex software and growing networks, application-specific
hardware and systems on chips (SoC) will become more and more relevant for all
related areas of industrial and consumer applications. In this regard, the IoT
promises to be one of the most disruptive technologies with transformational
impact on industry and society throughout the next decades. As a global super-
infrastructure, the IoT is a key enabling technology for a multitude of
application domains, including smart cities, smart cars, smart home, smart
health, smart factories, smart buildings, etc. However, related applications
and services are only feasible if the underlying systems do not fail and
disastrous real-world impacts are avoided, making dependability one of the main
design challenges.

The aim of the symposium is to bring together researchers and practitioners
from industry and academia. SIES provides a platform to report on recent
developments, deployments, technology trends and research results, as well as
to discuss and start initiatives related to embedded systems and their
applications in a variety of industrial environments.

Topics of interest include, but are not limited to:
- General Embedded Systems:
Dependability Aspects; Design and Validation; Operating Systems and
Middleware; Power Awareness; Adaptive and Compositional Systems.
- System-on-Chip and Network-on-Chip: Design & Testing; Multiprocessor Design;
Design of Application-Specific CPU/MCU Architectures; Platform-Based Design;
Reconfigurable Platforms; Implementation and Testing of Integrated Circuits.
- Networked Embedded Systems: Design, Dependability and Tooling; Middleware;
Network Protocols.
- Embedded Applications: Cyber-Physical Systems and the Internet of Things;
Domain Specific Systems (e.g., Industrial Automation and Control, Intelligent
Transportation, Automotive, Avionics and Aerospace, Smart Home, Wireless
Health Care, Automation and Control).

PAPER SUBMISSION AND PUBLICATION

SIES 2018 is a highly selective conference. We will only accept original
contributions that have not been previously published and are not currently
under review by any other conference or journal. The conference solicits
full papers, work-in-progress papers, and posters.

Submission implies the willingness of at least one author to attend SIES and
present the paper. Accepted papers will be included in the proceedings of SIES
2018 and submitted to IEEE explore for publication.

CO-LOCATED EVENT

SIES 2018 will be co-located with the "2nd Symposium on Dependable Internet of Things" (5 June 2018), presenting project results, talks by international experts, and an exhibition on the TU Graz LEAD
Project Dependable Internet of Things in Adverse Environments. Please visit the SIES website for further details: http://sies2018.tugraz.at/cms/index.php?id=60 Participation of free of charge for registered participants of SIES.

PROMOTED TALKS

SIES Conference - Keynote Presentations:
* AVL List GmbH, Graz
* TTTech Computertechnik AG, Vienna
* Elektrobit Automotive GmbH, Erlangen

IoT Symposium - Invited Talks:
* Lothar Thiele (Swiss Federal Institute of Technology Zurich)
"Internet of Things - The Quest for Trust"
* Daniel Lohmann (Leibniz University Hannover)
"Tailorable System Software for the Internet of Things: Rethinking the HW-SW Bridge"
* tba

IoT Symposium - Local Speakers:
* Klaus Witrisal (Dependable Localization)
"High-accuracy Positioning in Indoor Environments"
* Marcel Baunach (Dependable Computing)
"Compositional Computing Platforms for a Dependable Internet of Things"
* Bernhard Aichernig (Dependable Composition)
"Smart Testing of IoT Protocols - Combining Model Learning and Model-based Testing"
* Martin Horn (Dependable Control)
"Sliding-Mode Control for Networked Control Systems - Theory and Applications"

ORGANIZING COMMITTEE

General Co-Chairs:
- Marcel Baunach (TU Graz, Austria)
- Roman Obermaisser (University of Siegen, Germany)

Program Committee Co-Chairs:
- Roberto Passerone (Univ of Trento, Italy)
- Stig Petersen (SINTEF, Norway)

WiP and Posters Co-Chairs:
- Tobias Hossfeld (University of Duisburg, Germany)
- Haibo Zeng (VirginiaTech, USA)

IEEE CEDA Representative
- Yao-Wen Chang (National Taiwan University, Taiwan)

SIES Series Steering Committee:
- R. Ernst (TU Braunschweig, Germany)
- G. De Micheli (EPFL, Switzerland)
- R. Gupta (UC San Diego, USA)
- A. Sangiovanni-Vincentelli (UC Berkeley, USA)
- R. Zurawski (ISA Group, USA)

International Advisory Committee:
- J. J. Chen, Germany
- E. Dekneuvel, UNSA, France
- M. Di Natale, Scuola Superiore S. Anna, Italy
- L. Gomes, Uninova, Portugal
- T. Nolte, Malardalen University, Sweden
- R. Obermaisser, University of Siegen, Germany
- R. Passerone, Univ. of Trento, Italy SIES
- G. Sassatelli, LIRM, France
- J.-L. Scharbarg, INP-ENSEEIHT & IRIT, France
- E. Tovar, IPP, Portugal
- A. Vachoux, EPFL, Switzerland
- K. Zielinski, AGH UST, Poland