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Filters: Author is Chattopadhyay, A.  [Clear All Filters]
2020-11-09
Bose, S., Raikwar, M., Mukhopadhyay, D., Chattopadhyay, A., Lam, K..  2018.  BLIC: A Blockchain Protocol for Manufacturing and Supply Chain Management of ICS. 2018 IEEE International Conference on Internet of Things (iThings) and IEEE Green Computing and Communications (GreenCom) and IEEE Cyber, Physical and Social Computing (CPSCom) and IEEE Smart Data (SmartData). :1326–1335.
Blockchain technology has brought a huge paradigm shift in multiple industries, by integrating distributed ledger, smart contracts and consensus protocol under the same roof. Notable applications of blockchain include cryptocurrencies and large-scale multi-party transaction management systems. The latter fits very well into the domain of manufacturing and supply chain management for Integrated Circuits (IC), which, despite several advanced technologies, is vulnerable to malicious practices, such as overproduction, IP piracy and deleterious design modification to gain unfair advantages. To combat these threats, researchers have proposed several ideas like hardware metering, design obfuscation, split manufacturing and watermarking. In this paper, we show, how these issues can be complementarily dealt with using blockchain technology coupled with identity-based encryption and physical unclonable functions, for improved resilience against certain adversarial motives. As part of our proposed blockchain protocol, titled `BLIC', we propose an authentication mechanism to secure both active and passive IC transactions, and a composite consensus protocol designed for IC supply chains. We also present studies on the security, scalability, privacy and anonymity of the BLIC protocol.