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Filters: Author is Reed, J. H.  [Clear All Filters]
2023-03-17
Cheng, Xiang, Yang, Hanchao, Jakubisin, D. J., Tripathi, N., Anderson, G., Wang, A. K., Yang, Y., Reed, J. H..  2022.  5G Physical Layer Resiliency Enhancements with NB-IoT Use Case Study. MILCOM 2022 - 2022 IEEE Military Communications Conference (MILCOM). :379–384.
5G has received significant interest from commercial as well as defense industries. However, resiliency in 5G remains a major concern for its use in military and defense applications. In this paper, we explore physical layer resiliency enhancements for 5G and use narrow-band Internet of Things (NB-IoT) as a study case. Two physical layer modifications, frequency hopping, and direct sequence spreading, are analyzed from the standpoint of implementation and performance. Simulation results show that these techniques are effective to harden the resiliency of the physical layer to interference and jamming. A discussion of protocol considerations for 5G and beyond is provided based on the results.
ISSN: 2155-7586