3D Security: Trustworthy System Security Through 3D Integrated Hardware

ABSTRACT
This project is investigating a novel approach to trustworthy system development based on 3D integration, an emerging chip fabrication technique in which two or more integrated circuit dies are combined into a single stack using vertical conductive posts. Since the dies may be manufactured separately, 3D circuit integration offers the option of enhancing a commodity processor with a variety of custom security functions, which are manufacturing options applicable only to those systems that require them. This research introduces a fundamentally new method to incorporate security mechanisms into hardware and has the potential to significantly shift the economics of trustworthy systems.

Award ID: 0910734