ASP-DAC 2020

25th Asia and South Pacific Design Automation Conference (ASP-DAC 2020)

Aims of the Conference

ASP-DAC 2020 is the 25th annual international conference on VLSI design automation in Asia and South Pacific region, one of the most active regions of design and fabrication of silicon chips in the world. The conference aims at providing the Asian and South Pacific CAD/DA and Design community with opportunities of presenting recent advances and with forums for future directions in technologies related to Electronic Design Automation (EDA). The format of the meeting intends to cultivate and promote an instructive and productive interchange of ideas among EDA researchers/developers and system/circuit/device designers. All scientists, engineers, and students who are interested in theoretical and practical aspects of VLSI design and design automation are welcomed to ASP-DAC.

Areas of Interest:
Original papers in, but not limited to, the following areas are invited.

1. System-Level Modeling and Design Methodology:
1.1. HW/SW co-design, co-simulation and co-verification
1.2. System-level design exploration, synthesis and optimization
1.3. System-level formal verification
1.4. System-level modeling, simulation and validation tools/methodology

2. Embedded Systems and Cyberphysical Systems:
2.1. Many- and multi-core SoC architecture
2.2. IP/platform-based SoC design
2.3. Domain-specific architecture
2.4. Dependable architecture
2.5. Cyber physical system
2.6. Internet of things

3. Embedded Systems Software:
3.1. Kernel, middleware and virtual machine
3.2. Compiler and toolchain
3.3. Real-time system
3.4. Resource allocation for heterogeneous computing platform
3.5. Storage software and application
3.6. Human-computer interface

4. Memory Architecture and Near/In Memory Computing:
4.1. Storage system and memory architecture
4.2. On-chip memory architectures and management: Scratchpads, compiler, controlled memories, etc.
4.3. Memory and storage hierarchies with emerging memory technologies
4.4. Near-memory and in-memory computing
4.5. Memory architecture and management for emerging memory technologies

5. Neural Network and Neuromorphic Computing:
5.1. Hardware and devices for neuromorphic and neural network computing
5.2. Design method for learning on a chip
5.3. Systems for neural computing (including deep neural networks)
5.4. Neural network acceleration techniques including GPGPU, FPGA and dedicated ASICs
5.5. CAD for bio-inspired and neuromorphic systems

6. Analog, RF, Mixed Signal, and Photonics:
6.1. Analog/mixed-signal/RF synthesis
6.2. Analog layout, verification, and simulation techniques
6.3. High-frequency electromagnetic simulation of circuit
6.4. Mixed-signal design consideration
6.5. Communication architectures using nanophotonics, RF, 3D, etc.
6.6. Networks-on-chip and NoC-based system design

7. Lower Power Design and Approximate Computing:
7.1. Power modeling, analysis and simulation
7.2. Low-power design and methodology
7.3. Thermal aware design
7.4. Energy harvesting and battery management
7.5. Hardware techniques for approximate/stochastic computing

8. Logic/High-Level Synthesis and Optimization:
8.1. High-level synthesis tool and methodology
8.2. Combinational, sequential and asynchronous logic synthesis
8.3. Logic synthesis and physical design technique for FPGA
8.4. Technology mapping

9. Physical Design:
9.1. Floorplanning, partitioning and placement
9.2. Interconnect planning and synthesis
9.3. Placement and routing optimization
9.4. Clock network synthesis
9.5. Post layout and post-silicon optimization
9.6. Package/PCB/3D-IC routing

10. Design for Manufacturability and Reliability:
10.1. Reticle enhancement, lithography-related design and optimization
10.2. Resilience under manufacturing variation
10.3. Design for manufacturability, yield, and defect tolerance
10.4. Reliability, aging and soft error analysis
10.5. Design for reliability, aging, and robustness
10.6. Machine learning for smart manufacturing and process control

11. Timing and Signal/Power Integrity:
11.1. Deterministic/statistical timing and performance analysis and optimization
11.2. Power/ground and package modeling, analysis and optimization
11.3. Signal/power integrity, EM modeling and analysis
11.4. Extraction, TSV and package modeling
11.5. 2D/3D on-chip power delivery network analysis and optimization

12. Testing, Validation, Simulation, and Verification:
12.1. ATPG, BIST and DFT
12.2. System test and 3D IC test
12.3. Online test and fault tolerance
12.4. Memory test and repair
12.5. RTL and gate-leveling modeling, simulation, and verification
12.6. Circuit-level formal verification
12.7. Device/circuit-level simulation tool and methodology

13. Hardware and Embedded Security:
13.1. Hardware-based security
13.2. Detection and prevention of hardware Trojans
13.3. Side-channel attacks, fault attacks and countermeasures
13.4. Design and CAD for security
13.5. Cyberphysical system security
13.6. Nanoelectronic security
13.7. Supply chain security and anti-counterfeiting

14. Emerging Technologies and Applications:
14.1. Biomedical, biochip, and biodata processing
14.2. Big/thick data, datacenter
14.3. Advanced multimedia application
14.4. Energy-storage/smart-grid/smart-building design and optimization
14.5. Automotive system design and optimization
14.6. New transistor/device and process technology: spintronic, phase-change, single-electron etc.
14.7. Nanotechnology, MEMS, quantum computing etc.

General Information

General Co-Chairs:

• K.-T. Tim Cheng (Hong Kong University of Science and Technology)
• Huazhong Yang (Tsinghua University)

Technical Program Chair:

• Tsung-Yi Ho (National Tsing Hua University)

Technical Program Vice Co-Chairs:

• Sheldon Tan (University of California, Riverside)
• Yiran Chen (Duke University)

Design Contest Co-Chairs:

• Xiaoyang Zeng (Fudan University)
• Shouyi Yin (Tsinghua University)

Banquet Information

• Time: Jan. 15, 18:00-20:00
• Address: Room 311