CfP: IEEE Micro Special Series on Harsh Chips
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IEEE Micro Special Series on Harsh Chips
CALL FOR PAPERS
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Our apologies if you receive multiple copies of this message
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Guest Editors: Augusto Vega (IBM Research)
Alper Buyuktosunoglu (IBM Research)
Pradip Bose (IBM Research)
Submissions due: Jan 17, 2014
Publication date: 2014 - Various
Website: http://www.computer.org/portal/web/computingnow/micfp-series
Embedded chips are deployed almost everywhere, from mobile phones to
on-board electronics in automobiles and planetary rovers. Different
from conventional microprocessor designs, the operation conditions of
embedded processors are severely constrained by the environment. For
example, Unmanned Aerial Vehicle (UAV) chips demand significant
throughput for real-time processing despite their tight power budget.
To guarantee reliability in such harsh environments, the design and
operation of embedded processors should traverse different layers,
involving firmware, operating system, applications, as well as power
management units and communication interfaces. The goal of this IEEE
Micro series is to seek original papers on topics related to all
critical aspects of new-generation harsh environment-capable embedded
processors. This series will be published over several issues of IEEE
Micro.
Areas of interest include, but are not limited to:
- Applications and design issues related to Harsh Chips, e.g.
o AEROSPACE: unmanned aerial vehicles (UAVs), planetary rovers
and space probes, satellites, avionic systems, etc.
o MEDICAL SUPPORT: lifesaving monitors, portable medical devices,
high-end imaging systems, etc.
o OIL AND GAS EXPLORATION & EXTRACTION: unmanned underwater
vehicles (UUVs), measurement while drilling (MWD), logging
while drilling (LWD), etc.
o AERIAL SURVEILLANCE
o DISASTER search, rescue, and relief
o NOVEL APPLICATIONS for highly-reliable low-power embedded chips
- Architectural approaches for reliability assurance under low power
budgets
- Availability, soft-error tolerance and recovery issues
- Highly-reliable cache/memory hierarchies
- Massive heterogeneous processing capabilities
- Power management techniques
- Very-low power, reliable real-time processing
- Specialized accelerator architectures and unique designs
- Reusable and/or reconfigurable embedded designs
- Packaging and cooling
- Algorithm, application and software-based fault tolerance
- Cross-stack hardware/software techniques for reliability assurance
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SUBMISSION PROCEDURE:
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Log onto IEEE CS Manuscript Central (
https://mc.manuscriptcentral.com/micro-cs) and submit your manuscript.
Please direct questions to the IEEE Micro magazine assistant
(micro-ma@computer.org). For the manuscript submission, acceptable
file formats include Microsoft Word and PDF. Manuscripts should not
exceed 5,000 words including references, with each average-size figure
counting as 150 words toward this limit. Please include all figures
and tables, as well as a cover page with author contact information
(name, postal address, phone, fax, and mail address) and a 200-word
abstract. Submitted manuscripts must not have been previously
published or currently submitted for publication elsewhere, and all
manuscripts must be cleared for publication. All previously published
papers must have at least 30% new content compared to any conference
(or other) publication. Accepted articles will be edited for
structure, style, clarity, and readability. For more information,
please visit the IEEE Micro Author Center
(http://www2.computer.org/portal/web/peerreviewmagazines/acmicro)
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QUESTIONS?
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Contact Guest editor, Augusto Vega (ajvega@us.ibm.com)