Biblio

New hardware security threats are identified in emerging three-dimensional (3D) integrated circuits (ICs) and potential countermeasures are introduced. Trigger and payload mechanisms for future 3D hardware Trojans are predicted. Furthermore, a novel, network-on-chip based 3D obfuscation method is proposed to block the direct communication between two commercial dies in a 3D structure, thus thwarting reverse engineering attacks on the vertical dimension. Simulation results demonstrate that the proposed method effectively obfuscates the cross-plane communication by increasing the reverse engineering time by approximately 5x as compared to using direct through silicon via (TSV) connections. The proposed method consumes approximately one fifth the area and power of a typical network-on-chip designed in a 65 nm technology, exhibiting limited overhead.