Biblio
The globalization of the semiconductor supply chain introduces ever-increasing security and privacy risks. Two major concerns are IP theft through reverse engineering and malicious modification of the design. The latter concern in part relies on successful reverse engineering of the design as well. IC camouflaging and logic locking are two of the techniques under research that can thwart reverse engineering by end-users or foundries. However, developing low overhead locking/camouflaging schemes that can resist the ever-evolving state-of-the-art attacks has been a challenge for several years. This article provides a comprehensive review of the state of the art with respect to locking/camouflaging techniques. We start by defining a systematic threat model for these techniques and discuss how various real-world scenarios relate to each threat model. We then discuss the evolution of generic algorithmic attacks under each threat model eventually leading to the strongest existing attacks. The article then systematizes defences and along the way discusses attacks that are more specific to certain kinds of locking/camouflaging. The article then concludes by discussing open problems and future directions.
Logic locking is an attractive defense against a series of hardware security threats. However, oracle guided attacks based on advanced Boolean reasoning engines such as SAT, ATPG and model-checking have made it difficult to securely lock chips with low overhead. While the majority of existing locking schemes focus on gate-level locking, in this paper we present a layout-inclusive interconnect locking scheme based on cross-bars of metal-to-metal programmable-via devices. We demonstrate how this enables configuring a large obfuscation key with a small number of physical key wires contributing to zero to little substrate area overhead. Dense interconnect locking based on these circuit level primitives shows orders of magnitude better SAT attack resiliency compared to an XOR/XNOR gate-insertion locking with the same key length which has a much higher overhead.