Biblio

Existing works on Three-dimensional (3D) hardware security focus on leveraging the unique 3D characteristics to address the supply chain attacks that exist in 2D design. However, 3D ICs introduce specific and unexplored challenges as well as new opportunities for managing hardware security. In this paper, we analyze new security threats unique to 3D ICs. The corresponding attack models are summarized for future research. Furthermore, existing representative countermeasures, including split manufacturing, camouflaging, transistor locking, techniques against thermal signal based side-channel attacks, and network-on-chip based shielding plane (NoCSIP) for different hardware threats are reviewed and categorized. Moreover, preliminary countermeasures are proposed to thwart TSV-based hardware Trojan insertion attacks.

3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks, hardware trojans, secure IC manufacturing and IP piracy. By utilizing intrinsic characteristics of 2.5D and 3D technologies, we propose novel opportunities in designing secure systems. We present: (i) a 3D architecture for shielding side-channel information; (ii) split fabrication using active interposers; (iii) circuit camouflage on monolithic 3D IC, and (iv) 3D IC-based security processing-in-memory (PIM). Advantages and challenges of these designs are discussed, showing that the new designs can improve existing countermeasures against security threats and further provide new security features.

3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with emerging security challenges such as side channel attacks, hardware trojans, secure IC manufacturing and IP piracy. By utilizing intrinsic characteristics of 2.5D and 3D technologies, we propose novel opportunities in designing secure systems. We present: (i) a 3D architecture for shielding side-channel information; (ii) split fabrication using active interposers; (iii) circuit camouflage on monolithic 3D IC, and (iv) 3D IC-based security processing-in-memory (PIM). Advantages and challenges of these designs are discussed, showing that the new designs can improve existing countermeasures against security threats and further provide new security features.