Security Threats and Countermeasures in Three-Dimensional Integrated Circuits
| Title | Security Threats and Countermeasures in Three-Dimensional Integrated Circuits |
| Publication Type | Conference Paper |
| Year of Publication | 2017 |
| Authors | Dofe, Jaya, Gu, Peng, Stow, Dylan, Yu, Qiaoyan, Kursun, Eren, Xie, Yuan |
| Conference Name | Proceedings of the on Great Lakes Symposium on VLSI 2017 |
| Publisher | ACM |
| Conference Location | New York, NY, USA |
| ISBN Number | 978-1-4503-4972-7 |
| Keywords | 3d security, hardware attacks, Hardware Trojans, Human Behavior, monolithic 3d ics, network on chip security, pubcrawl, resilience, Resiliency, Scalability, side-channel attacks, supply chain, supply chain security, through-silicon-via |
| Abstract | Existing works on Three-dimensional (3D) hardware security focus on leveraging the unique 3D characteristics to address the supply chain attacks that exist in 2D design. However, 3D ICs introduce specific and unexplored challenges as well as new opportunities for managing hardware security. In this paper, we analyze new security threats unique to 3D ICs. The corresponding attack models are summarized for future research. Furthermore, existing representative countermeasures, including split manufacturing, camouflaging, transistor locking, techniques against thermal signal based side-channel attacks, and network-on-chip based shielding plane (NoCSIP) for different hardware threats are reviewed and categorized. Moreover, preliminary countermeasures are proposed to thwart TSV-based hardware Trojan insertion attacks. |
| DOI | 10.1145/3060403.3060500 |
| Citation Key | dofe_security_2017 |