Submitted by Anonymous on Mon, 02/08/2016 - 12:05pm
11th International Symposium on Reconfigurable Communication-centric Systems-on-Chip (ReCoSoC 2016)
Over the past decade ReCoSoC has established itself as a international reference event for research in the areas of reconfigurable and communication-centric systems-on-chip. Its informal and dynamic philosophy encourages technical and scientific interactions of both academic and industrial participants through presentations and special sessions reporting latest advances in the related areas.
Cyber-physical additive layer manufacturing, e.g. 3D printing has become a promising technology for providing cost, time, and space effective solution by reducing the gap between the designers and the manufacturers. However, the concern for the protection of intellectual property is arising in conjunction with the capabilities of supporting massive innovative designs and rapid prototyping.
The overarching goal of this project is to develop a novel cyberphysical platform for fast and efficient, fully digital, 3-dimensional, 5-axis machining. Proposed methodology is inspired by 3D printing, which is easy to program but limited in terms of the materials that can be used, the finishing quality that can be achieved, and relatively slow printing speeds. By contrast, CNC milling can address these limitations.
