Visible to the public S℡LAR: A Generic EM Side-Channel Attack Protection through Ground-Up Root-Cause Analysis

TitleS℡LAR: A Generic EM Side-Channel Attack Protection through Ground-Up Root-Cause Analysis
Publication TypeConference Paper
Year of Publication2019
AuthorsDas, Debayan, Nath, Mayukh, Chatterjee, Baibhab, Ghosh, Santosh, Sen, Shreyas
Conference Name2019 IEEE International Symposium on Hardware Oriented Security and Trust (HOST)
KeywordsCMOS integrated circuits, composability, critical encryption signature, critical signal radiation, cryptographic hardware, cryptography, EM leakage, EM probes, EM SCA attack, EM Side-channel attack, Encryption, entire crypto IP, entire cryptographic core, example cryptographic block, external attacker, frequency 40.0 MHz, Generic countermeasure, generic EM side-channel attack protection, Ground-up EM Leakage Modeling, ground-up root-cause analysis, high-resolution electromagnetic probes, higher-level metal layers, integrated circuit, Integrated circuit modeling, Intel 32 nm CMOS technology interconnect stack, Internet, low-level metal routing, low-overhead solution, lower-level metal layers, lower-level metal routing, Metals, Metrics, noninvasive attacker, noninvasive electromagnetic side-channel attacks, power side-channel countermeasures, Probes, pubcrawl, resilience, Resiliency, resource-constrained Internet-connected devices, Routing, side-channel analysis attacks, signature attenuation embedded CRYPTO, signature attenuation hardware, size 32.0 nm, size 65.0 nm, S℡LAR, S℡LAR hardware, system-level EM simulations, system-level implementation, telecommunication network routing, top-level metal layers, TSMC 65 nm CMOS technology, two-stage solution, white box cryptography, white-box analysis, white-box understanding
AbstractThe threat of side-channels is becoming increasingly prominent for resource-constrained internet-connected devices. While numerous power side-channel countermeasures have been proposed, a promising approach to protect the non-invasive electromagnetic side-channel attacks has been relatively scarce. Today's availability of high-resolution electromagnetic (EM) probes mandates the need for a low-overhead solution to protect EM side-channel analysis (SCA) attacks. This work, for the first time, performs a white-box analysis to root-cause the origin of the EM leakage from an integrated circuit. System-level EM simulations with Intel 32 nm CMOS technology interconnect stack, as an example, reveals that the EM leakage from metals above layer 8 can be detected by an external non-invasive attacker with the commercially available state-of-the-art EM probes. Equipped with this `white-box' understanding, this work proposes S(tel)LAR: Signature aTtenuation Embedded CRYPTO with Low-Level metAl Routing, which is a two-stage solution to eliminate the critical signal radiation from the higher-level metal layers. Firstly, we propose routing the entire cryptographic core within the local lower-level metal layers, whose leakage cannot be picked up by an external attacker. Then, the entire crypto IP is embedded within a Signature Attenuation Hardware (SAH) which in turn suppresses the critical encryption signature before it routes the current signature to the highly radiating top-level metal layers. System-level implementation of the S(tel)LAR hardware with local lower-level metal routing in TSMC 65 nm CMOS technology, with an AES-128 encryption engine (as an example cryptographic block) operating at 40 MHz, shows that the system remains secure against EM SCA attack even after 1M encryptions, with 67% energy efficiency and 1.23x area overhead compared to the unprotected AES.
DOI10.1109/HST.2019.8740839
Citation Keydas_slar_2019