Understanding Transition and Remanence Noise in HAMR
Title | Understanding Transition and Remanence Noise in HAMR |
Publication Type | Journal Article |
Year of Publication | 2018 |
Authors | Jiao, Y., Hohlfield, J., Victora, R. H. |
Journal | IEEE Transactions on Magnetics |
Volume | 54 |
Pagination | 1–5 |
ISSN | 0018-9464 |
Keywords | applied field, bit length, composability, compositionality, Computational modeling, cyber physical systems, GP, grain pitch, Heat-assisted magnetic recording, Heat-assisted magnetic recording (HAMR), Internet of Things, Jitter, magnetic recording noise, Magnetic Remanence, Media, media noise, principal component analysis, principal components analysis, principal components analysis (PCA), pubcrawl, remanence, remanence noise, Resiliency, Signal to noise ratio, spatial splitting, transition noise, Writing |
Abstract | Transition noise and remanence noise are the two most important types of media noise in heat-assisted magnetic recording. We examine two methods (spatial splitting and principal components analysis) to distinguish them: both techniques show similar trends with respect to applied field and grain pitch (GP). It was also found that PW50can be affected by GP and reader design, but is almost independent of write field and bit length (larger than 50 nm). Interestingly, our simulation shows a linear relationship between jitter and PW50NSRrem, which agrees qualitatively with experimental results. |
URL | https://ieeexplore.ieee.org/document/8405760 |
DOI | 10.1109/TMAG.2018.2841859 |
Citation Key | jiao_understanding_2018 |
- Jitter
- Writing
- transition noise
- spatial splitting
- Signal to noise ratio
- remanence noise
- remanence
- pubcrawl
- principal components analysis (PCA)
- principal components analysis
- principal component analysis
- media noise
- Media
- magnetic recording noise
- Magnetic Remanence
- Heat-assisted magnetic recording (HAMR)
- Heat-assisted magnetic recording
- grain pitch
- GP
- Computational modeling
- composability
- bit length
- applied field
- cyber physical systems
- Internet of Things
- Compositionality
- Resiliency