Title | The Survey on Intellectual Property Based on Blockchain Technology |
Publication Type | Conference Paper |
Year of Publication | 2019 |
Authors | Yang, Fan, Shi, Yue, Wu, Qingqing, Li, Fei, Zhou, Wei, Hu, Zhiyan, Xiong, Naixue, Zhang, Yong |
Conference Name | 2019 IEEE International Conference on Industrial Cyber Physical Systems (ICPS) |
Keywords | bitcoin, blockchain, blockchain system, blockchain technology, composability, consensus mechanism, copyright, copyrights, cross-chain, cryptocurrencies, Distributed databases, encryption algorith, Industries, intellectual property, Internet, ip protection, optimisation, Optimization, optimization mechanisms, policy-based governance, Proof of Stake, pubcrawl, resilience, Resiliency, resource consumption, Tamper-Resistance, Time delay, transaction anonymity, transaction throughput |
Abstract | The characteristics of decentralization, tamper-resistance and transaction anonymity of blockchain can resolve effectively the problems in traditional intellectual property such as the difficulty of electronic obtaining for evidence, the high cost and low compensation when safeguarding the copyrights. Blockchain records the information through encryption algorithm, removes the third party, and stores the information in all nodes to prevent the information from being tampered with, so as to realize the protection of intellectual property. Starting from the bottom layer of blockchain, this paper expounds in detail the characteristics and the technical framework of blockchain. At the same time, according to the existing problems in transaction throughput, time delay and resource consumption of blockchain system, optimization mechanisms such as cross-chain and proof of stake are analyzed. Finally, combined with the characteristics of blockchain technology and existing application framework, this paper summarizes the existing problems in the industry and forecasts the development trend of intellectual property based on blockchain technology. |
DOI | 10.1109/ICPHYS.2019.8780125 |
Citation Key | yang_survey_2019 |