| Title | Standard CMOS Integrated Ultra-Compact Micromechanical Oscillating Active Pixel Arrays |
| Publication Type | Conference Paper |
| Year of Publication | 2021 |
| Authors | Bhosale, Kalyani, Chen, Chao-Yu, Li, Ming-Huang, Li, Sheng-Shian |
| Conference Name | 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS) |
| Keywords | Arrays, BEOL, CMOS technology, CMOS-MEMS, composability, Metrics, Micromechanical devices, nonlinear vibration, oscillating behaviors, Oscillators, phase noise, privacy, pubcrawl, Resiliency, Resonant frequency, resonant pixels, Resonators, Standards, Titanium nitride, Vibrations |
| Abstract | This work demonstrates an ultra-compact low power oscillating micromechanical active pixel array based on a 0.35 mm back-end of line (BEOL)-embedded CMOS-MEMS technology. Each pixel consists of a 3-MHz clamped-clamped beam (CCB) MEMS resonator and a power scalable transimpedance amplifier (TIA) that occupies a small area of 70 x 60 mm2 and draws only 85 mW/pixel. The MEMS resonator is placed next to the TIA with less than 10 mm spacing thanks to the well-defined etch stops in the titanium nitride composite (TiN-C) CMOS-MEMS platform. A multiplexing phase-locked loop (PLL)-driven oscillator is employed to demonstrate the chip functionality. In particular, a nonlinear operation of the resonator tank is used to optimize the phase noise (PN) performance and Allan deviation (ADEV) behavior. The ADEV of 420 ppb averaged over best 3-pixels is exhibited based on such a nonlinear vibration operation. |
| DOI | 10.1109/MEMS51782.2021.9375392 |
| Citation Key | bhosale_standard_2021 |
Standard CMOS Integrated Ultra-Compact Micromechanical Oscillating Active Pixel Arrays