| Title | Integrated High Power Micro Magnets for MEMS Sensors and Actuators |
| Publication Type | Conference Paper |
| Year of Publication | 2019 |
| Authors | Lisec, Thomas, Bodduluri, Mani Teja, Schulz-Walsemann, Arne-Veit, Blohm, Lars, Pieper, Isa, Gu-Stoppel, Shanshan, Niekiel, Florian, Lofink, Fabian, Wagner, Bernhard |
| Conference Name | 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems Eurosensors XXXIII (TRANSDUCERS EUROSENSORS XXXIII) |
| Date Published | jun |
| Keywords | back-end-of-line compatible integration, boron alloys, cleanroom environment, compositionality, elemental semiconductors, integrated high power micromagnets, iron alloys, Magnetic flux, magnetic MEMS, magnetic resonance imaging, Magnetic separation, MEMS sensors, Micro magnets, microactuators, micromagnet arrangements, Micromechanical devices, microsensors, neodymium alloys, permanent magnetic structures, Permanent magnets, pubcrawl, remanence, remanent magnetization, Resiliency, Resists, Si-NdFeB, Silicon, silicon frames, size 25.0 mum to 2000.0 mum, size 8.0 inch, substrate conditioning procedures, Substrates, Surface treatment |
| Abstract | Back-end-of-line compatible integration of NdFeB-based micro magnets onto 8 inch Si substrates is presented. Substrate conditioning procedures to enable further processing in a cleanroom environment are discussed. It is shown that permanent magnetic structures with lateral dimensions between 25mm and 2000mm and a depth up to 500mm can be fabricated reliably and reproducibly with a remanent magnetization of 340mT at a standard deviation as low as 5% over the substrate. To illustrate post-processing capabilities, the fabrication of micro magnet arrangements embedded in silicon frames is described. |
| DOI | 10.1109/TRANSDUCERS.2019.8808804 |
| Citation Key | lisec_integrated_2019 |
Integrated High Power Micro Magnets for MEMS Sensors and Actuators